The development of ultra-large-scale integrated circuits have allowed semiconductor device components to shrink in size. Low dielectric constant materials are essential for interconnections as well as reduction of crosstalk noise and power consumption in these smaller devices. Although researchers traditionally have used SiO₂ as the main dielectric material,¹ their studies have also explored many low-dielectric-constant materials,^2–4 such as Si₃N₄–SiO₂ ceramics and zeolite films.⁵

Kaolin clay is a naturally abundant composition of hydrated aluminum silicates [i.e, Al₄(Si₄O₁₀)(OH)₂] that consists primarily of SiO₂ and Al₂O₃. High-temperature treatment converts kaolin clay to mullite and free silica, which together form strong internal bonds that result in excellent strength. Therefore, kaolin is used worldwide for applications such as clay ceramics,⁶ zeolites for nicotine^7,8 and asphaltene⁹ adsorption, and substrate insulation.¹⁰ Kaolin also is relatively inexpensive,^11–13 so it has significant potential as a low-dielectric-constant material.