Shortages in the semiconductor supply chain have influenced most electronics industries, holding back sales of everything from automobiles to gaming consoles. The shortage shone a light on the need for more efficient manufacturing of computer chips.

Ultrafine structured glass offers a game-changing element to semiconductor packaging. Structured glasses combine the smooth surfaces and mechanical stiffness of expensive single crystal silicon wafers with the large formats of copper clad laminate. Structured glass substrates also offer increased signal performance, high manufacturing precision, reduced signal latency, and cost efficiency compared to the printed circuit boards and silicon interposers traditionally used for advanced chip packaging solutions.